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Title Producing state-of-the-art semiconductor chips using molds
Writer Admin Date 2006-04-18 Hits 2137
- Nano-implant becomes the next-generation technology to produce micro circuits -


The boom in nano-technology, in and out of the country, is affecting production procedures of semiconductor chips. Nano-implant technology replaces the expensive and complicated procedures used in the photographic development method, a core step in producing semiconductor chips. Nano-implant technology is getting noticed as the next-generation technology to form circuits for semiconductors and flat panel displays (FPD).



Nano-implant technology is expected to overcome the limits of micronization used in the current photographic development method to produce semiconductors. With nano-implants, a mold (stamp) carved with micro circuits is pressed on the surface of sprayed material, effectively producing micro circuits with less cost. This low-cost, high-productive technology can be subdivided according to the materials used. The ultraviolet implant method uses materials responding to ultraviolet, and the heat printing implant method uses materials responding to heat. (Picture 1, 2)

In order to realize high-density semiconductors using nano-implant technology, other new methods are necessary, such as micro-circuit production that considers physical phenomena in nano-scale, stamp production, material development, and nano-scaled minute controls to develop implant facilities. Today, high density semiconductor micro circuits of 10nm width can be produced theoretically by implant procedure. The International Technology Roadmap for Semiconductors (ITRS), a document which details global trends for semiconductor production, introduced semiconductor production technology that can produce micro circuits of 20nm width. (Picture 3)

Considering that the conventional photographic development method produces semiconductors about 100nm in width, this new technology is very innovative.


During the past 5 years (2001~ 2005) as interest on nano-implant increased, 137 domestic patents applications were related to implant. In addition to patents related to conventional implant technologies and not purposed for micro circuit printing, 40 patents were related to nano-implant technology. Although there were only 5 applications until 2002, the number of domestic applications increased starting in 2003, and the number reached 34 by 2004, showing an 85% ratio. This result shows that the demands and interests of the domestic semiconductor industry increased starting in 2003, trying to overcome the limits of micronization in the conventional photographic development method.


Looking at the applicants, domestic companies held a big portion of 40%. Among these companies, LG Electronics developed display materials where nano-implant technology is applied, such as polarizing film for projection TVs. On the other hand, LG Philips LCD is developing a technology forming a TFT circuit through nano-implant, while Korea Institute of Machinery and Materials is leading the development of ultraviolet implant facilities. Foreign companies held 18% of total applications. Among these are Nanonex, established by Professor S. Chou of Princeton University, the originator of heat printing implant, and MII of the US, which is judged to have the most improved technology related to ultraviolet implant method.


Looking at the application ratio of specific technology, technologies for developing nano-implant facilities and micro circuit held 65% of the total. Such technologies are known as the core technology for applying nano-implant technology to the mass-produced semiconductor industry in the future. 22% was related to technology for developing respondent materials for implant, requiring a more complicated physical property than materials used in previous photographic development method. 5% was related to technology for developing stamps, which are the original mold of micro circuit used in nano-implant procedure.


Demands for semiconductor will increase continuously, and companies will put effort into producing more of these semiconductors at less cost. Placed on the core of such effort, the future of domestic nano-implant technology is expected to be very promising.
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